News and Events
  • PackExpo International 2020

    Event Dates:  08 November 2020 - 11 November 2020
    Location:  Chicago, IL
    Venue:  McCormick Place
    Booth Number:  S-4143

    Attend the largest packaging show in North America!  PackExpo International offers something for everyone in the packaging industry from the latest technologies to changing consumer trends.

    Join Teledyne TapTone in booth S-4143 to see how the latest innovations in packaging inspection can help you test your products. See our latest product, the Seal Integrity Tester, our custom solution for package inspection that is situated inside the filler.